1666 PA Hartlotpaste

Castolin 1666 PA

Ready-to-use, dosable binder suspension made from high-silver, fine-grained brazing powder with flux components in an optimum mixing ratio. The paste is intended for manual and mechanized processing. Due to its precisely defined viscosity and homogeneous consistency, it is particularly suitable for series production with automated dosing equipment. Low-viscosity solder with low soldering temperature. Low distortion and low oxidation of the parts to be soldered.
parts to be soldered. Dense, fine and clean seams. Paste and flux residues are water-soluble.

Technical data
Brazing alloy
ISO 17672: Ag 145
EN 1044: AG 104
DIN 8513: L-Ag45Sn

Flux content
EN 1045: FH 10
DIN 8511: F-SH1

Melting interval (Sol./Liq.) [°C]: 640 - 680
Soldering temperature [°C]: 670
Density (paste) [g/cm3]: approx. 2.6
Density (solder content) [g/cm3]: approx. 9.2
Grain size (solder content) [μm]: < 70
Solder powder content [% by weight]: 53

Applications
For joining iron and copper materials as well as stainless steels, hard metals, nickel and nickel alloys.

Typical applications are
Containers, apparatus and equipment for the food industry, surgical and optical instruments, silver contacts, bronze and brass fittings, piping, nozzles, stainless steel cladding, apparatus for heating and cooling technology, precision mechanics, eyeglass manufacturing, costume jewelry, art objects.

Processing instructions
Make the joint area bright, deburr and round/bevel edges if necessary. Apply the well-mixed solder paste to the solder joint by hand or using a dosing device. Fix smaller workpieces accordingly to ensure the recommended solder gap width of 0.05 to approx. 0.1 mm during soldering. Remove corrosive flux residues.

Soldering with the oxy-fuel torch
Set the flame to neutral or with a slight excess of acetylene. Burn off the binding agent or allow it to evaporate. Heat the solder joint indirectly with a flame until the solder flows out. Do not overheat.

Soldering in the oven
Allow the inert binder to evaporate from the solder paste at a temperature of approx. 150 °C (using hot air, infrared lamp, oven). For subsequent soldering - especially with solid workpieces - the use of an inert gas or continuous furnace is advantageous.
The soldering temperature in the oven should be at least 720 °C.
Other methods such as induction or resistance soldering can also be used.